Description
UVALAM Di-9286 is one component, UV and heating dual curing modified epoxy resin.
It is free of solvents, low CTE, humidity-resistant, light-fixable, low out-gassing, filled, low swelling, reproducible, low shrinkage, fast fixation.
Special features of product
Compliant with RoHS Directive 2015/863/EU
Halogen-free
Low-out-gassing
Compliant with limits of VOC content in adhesive
Function
Electronic adhesive
Typical area of use
-50 - 160 °C
Active alignment for camera modules
Fast component fixation
Dual Curing system
UVA(320-400nm) 3-10 seconds
2000mW/cm2+60min@80°C
Processing
Typical adhesive application: needle dispensing
Conditioning time (typical)
|
When stored in cold conditions in containers up to 50 ml |
1 h |
|
when stored in cold conditions in containers up to 170 ml |
2 h |
Processing time
in standard climate +23 °C / 50 % r. h.: 72 h
Technical properties
|
Color in cured condition in 0.1 mm layer thickness |
yellow |
|
Transparency in cured condition in 0.1 mm layer thickness |
Translucent |
|
Color in cured condition in 1 mm layer thickness |
yellow |
|
Transparency in cured condition in 1 mm layer thickness |
Translucent |
Parameters
|
Density |
1.6g/cm³ |
|
Viscosity |
22,000 mPa·s |
|
Thixotropy index |
7 |
|
Maximum curable layer thickness |
0.70mm |
|
Compression shear strength Al, anodized/Al, anodized | 130 °C | 5 min | Plus | at approx. +23 °C | 24 h |
40 mpa |
|
Compression shear strength FR4 /FR4| 130 °C | 5 min | Plus | at approx. +23 °C | 24 h |
26 mpa |
|
Compression shear strength Glass/Glass | 365 nm | 150 mW/cm² | 10 s | Plus | at approx. +23 °C | 24 h |
20 mpa |
|
Compression shear strength PPS | PPS | 130 °C | 5 min | Plus | at approx. +23 °C | 24 h |
30 mpa |
|
Tensile strength |
40 mpa |
|
Elongation at tear |
0.8% |
|
modulus |
7000ma |
|
Shore hardness D |
88 |
|
Glass transition temperature |
179°C |
|
Coefficient of linear expansion |
38 ppm/k |
|
Shrinkage |
1.6% volume |
|
Water absorption |
0.08% wt. |
General curing and processing information
The curing time stated in the technical data was determined in the laboratory.
It can vary depending on the adhesive quantity and component geometry and is therefore a reference value.
The heating time of the components must be added to the actual curing time.
It depends on component size and type of heat input.
The specified curing temperature must be reached directly at the adhesive.Increasing or decreasing the curing temperature and/or irradiation intensity and/or irradiation time shortens or prolongs the curing time and can lead to changed physical properties.
Parameters can vary for pure light curing, pure heat curing and a combination of light and heat curing.
Depending on the adhesive quantity used, exothermic reaction heat is generated which can lead to overheating.
In this case, a lower curing temperature is to be selected.
All curing or light fixation parameters depend on material thickness and absorption, adhesive layer thickness, lamp type and distance between lamp and adhesive layer.
Curing until final strength proceeds within 24 hours at room temperature.
Light and heat curing mechanisms can be used independently. High temperatures during or after curing can lead to post-cross-linking of the adhesive which influences the physical properties of the bond.
Storage & shelf life
The shelf time is 12 months in unopened original container at -20 °C.
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